|About the Book|
This hands-on booklet is packed full of practical examples of how to perform heat transfer analysis. It guides the reader from fundamental principles to detailed knowledge that can be applied immediately. The know-how contained in this booklet willMoreThis hands-on booklet is packed full of practical examples of how to perform heat transfer analysis. It guides the reader from fundamental principles to detailed knowledge that can be applied immediately. The know-how contained in this booklet will be useful to both the beginner and the experienced thermal analyst since it has the right details necessary. The authors are practicing engineers with first-hand experience designing and analyzing electronics for heat transfer.The booklet starts out in Chapter 1 with an introduction to heat transfer. It describes why heat transfer is important and the mechanism of heat transfer. We describe why the book focuses on conduction. We then discuss Fourier’s heat conduction equation and how it applies to the analysis of electronic components.Chapter 2 shows how to calculate heat dissipation in amplifiers. This is important since most microwave and millimeter-wave products use amplifiers which dissipate the majority of the power. We show a hands-on example of heat dissipation from a two amplifier transmit module. We also review power added efficiency and duty cycle.Chapter 3 describes compact and straight forward methods to determine the junction temperature in electronic devices. This is important since the junction temperature determines the long term reliability. We show how to calculate the temperature rise in the electronic packaging.Chapter 4 presents the five steps to success with commercial FEM thermal modeling. It shows modeling the electronic device, creating a 3D model assembly, creating a successful mesh, setting boundary conditions, and running the thermal simulation.Chapter 5 shows how to create an equivalent thermal network and use electric circuit simulators for the solution. It also describes the 1-D heat transfer equation. The chapter focuses on the real world analysis of a package fabricated in HTCC alumina and shows how to analyze the metal layers and internal vias to predict the thermal resistance of the stack.Chapter 6 outlines how to perform reliability calculations based upon heat transfer results. This is important since one of the main purposes of heat transfer analysis in electronics is to ensure long term reliability. We describe accelerated life testing, activation energy, mean time to failure (MTTF), and industry standards used in accelerated life testing.Chapter 7 concludes the book with a short review of the topics discussed.If you are looking to expand your knowledge of heat transfer analysis or are looking for a reference that will provide the knowledge needed for heat transfer of microwave and millimeter-wave electronics, then this book will be a welcome addition for you.